Single Part 3W/m.K Silicone Thermal Conductivity Gap Filler For LCD TVs
| Attribute | Value | Test Method |
| Composition | Ceramic filler + Silicone | - |
| Color | Green | Visual |
| Density(g/cc) | 2.9 | ASTM D792 |
| Extrudability(g/s) | 5.0 | ISO9048 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | | |
| Breakdown Voltage(kv/mm) | ≥5.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.3 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1014 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | | |
| Thermal conductivity(W/m.K) | 3.0 | ASTM D5470 |
Product feature
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■The thermal conductivity gap filler has ultra-low thermal resistance, which can optimize the heat dissipation performance of the product.
■The research and design is convenient. The thermal conductivity gap filler is mud like and permanent self-adhesive. The product design does not need to specially consider the limitations of product size and tolerance, and can be flexibly designed according to the effect.
■Convenience of purchase management. One model and specification of thermal conductivity gap filler can meet the needs of multiple models and products, greatly simplifying the purchase management and storage management.
■The thermal conductivity gap filler can realize process automation. The glue dispenser independently developed by sirnice or purchased by the market can be used to realize the automatic glue dispensing process, which greatly improves the construction efficiency, reduces the labor cost and time cost, and optimizes the stability of the product.
Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Purchasing information
Packing specification: 300ml Cartridge/ 1kg Jar/20kg Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
Product Tags:
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Heatproof Single Thermally Conductive Filler , Anti Corrosion Thermal Gap Filler Images
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